2. Placement parts: Located behind the solder paste screen printing equipment. At first, prepare the corresponding product program in advance and import to the machine, then it will accurately paste the parts on the right position of PCB according to the program. There maybe a high-speed placement machine plus one more Multi-functional machine.

3. Reflow oven is the third process of SMD, located behind the placement machine, melting the solder or glue, so that the surface assembled components and the PCB board are firmly bonded together. It has 7-14 different temperature zones, you can set different temperatures according to different products and PCB, the highest can reach more than 300 degrees.

4. AOI optical inspection: inspect the soldering quality and assembly quality of the assembled PCB board. The equipment used is automatic optical inspection (AOI), It will be displayed if there is a problem on PCBA,  then employees need to be labeled on the position to distinguish.